Method for producing multi-layer circuit board and resulting art

Details Method for producing multi-layer circuit board and resulting art Method for producing multi-layer circuit board and resulting art

1996-11-20

1998-01-20

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Forming or treating of groove or through hole

216 20, B44C 122, C23F 100

Patent

active

057098050

ABSTRACT:
A method for producing a panel of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of coating a circuitized core material that has been cut into panels with a dielectric material and copper cover sheets; forming circuits from the cover sheets by etching; applying an adhesive polymer across the dielectric material covering the entire area of the panel; applying a cover sheet; drilling the panel to form through-holes and vias; seeding and plating the through-holes and vias with joining metal; applying photo-resist to the panels exposed with an image of the area of the panel to be joined and developed; and etching the cover sheet and the photo-resist away in the area of the panel to be joined to expose the adhesive polymer.

REFERENCES:
patent: 5153986 (1992-10-01), Brauner et al.
patent: 5284548 (1994-02-01), Carey et al.
patent: 5582745 (1996-12-01), Hans et al.

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