Method for producing multi-layer circuit board and resulting art

Details Method for producing multi-layer circuit board and resulting art Method for producing multi-layer circuit board and resulting art

1996-09-05

1998-11-03

Loring, Susan A.

Etching a substrate: processes

Forming or treating electrical conductor article

438400, 438416, H05K 300

Patent

active

058303740

ABSTRACT:
A method for producing a layer of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of selecting a core material from one of three iron
ickel alloys, namely either (i) 58% Fe/42% Ni; (ii) 60% Fe/39% Ni/1% Cu; or (iii) 60% Fe/38.7% Ni/0.12% Mn/0.07% Si; forming the core material into a panel suitable for an intended application; cleaning the panel in preparation for plating; plating the panel with copper; subjecting the plated panel to heat treatment; and circuitizing the panel as appropriate for the intended application.

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