Method for producing multi-layer circuit board and resulting art

Details Method for producing multi-layer circuit board and resulting art Method for producing multi-layer circuit board and resulting art

1998-02-13

2000-02-29

Jones, Deborah

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

361792, 361793, 361794, 361795, 174257, 420 92, B32B 900

Patent

active

060306939

ABSTRACT:
A method for producing a layer of a multi-layer electronic circuit package and resulting article of manufacture is provided comprising the steps of selecting a core material from one of three iron
ickel alloys, namely either (i) 58% Fe/ 42% Ni; (ii) 60% Fe/39% Ni/1% Cu; or (iii) 60% Fe/38.7% Ni/.12% Mn/.07% Si; forming the core material into a panel suitable for an intended application; cleaning the panel in preparation for plating; plating the panel with copper; subjecting the plated panel to heat treatment; and circuitizing the panel as appropriate for the intended application.

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