Method for producing multi-board electronic device

Details Method for producing multi-board electronic device Method for producing multi-board electronic device

1995-03-06

1996-12-24

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29827, 29830, 29848, H05K 330, H01R 4324, H05K 336

Patent

active

055863892

ABSTRACT:
In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel to the major plane, and mounted selected electronic circuits thereon respectively, and first and second closure lids for closing the openings in the major plane; the first closure lid contacting with the surface of at least one of the circuit boards, on which no electronic circuit is mounted. Also, on the inner wall of the frame; appropriate stepped portions are formed for supporting the closure lid member, the supporting plate, the circuit board and so forth, Furthermore, in the stepped portion, a portion to accommodate an excess amount of an adhesive is provided.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne et al.
patent: 3710193 (1973-01-01), Greenberg et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4296456 (1981-10-01), Reid
patent: 4533976 (1985-08-01), Suwa
patent: 4584767 (1986-04-01), Gregory
patent: 4677526 (1987-06-01), Muehling
patent: 4766520 (1988-08-01), Huber et al.
patent: 4802859 (1989-02-01), Gouldy et al.
patent: 4857483 (1989-08-01), Steffen et al.
patent: 4873615 (1989-10-01), Grabbe
patent: 4916575 (1990-04-01), Van Asten
patent: 4985747 (1991-01-01), Utunomiya et al.
patent: 4989318 (1991-02-01), Utunomiya et al.
patent: 5031069 (1991-07-01), Anderson
patent: 5045971 (1991-09-01), Ono et al.
patent: 5081764 (1992-01-01), Utunomiya et al.
patent: 5157588 (1992-10-01), Kim et al.
Patent Abstracts of Japan, vol. 13, No. 407, p. 60 E 818, Kokai No. 1-147, 850 English Abstract, Jun. 1989.

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