Method for producing molded circuit boards

Details Method for producing molded circuit boards Method for producing molded circuit boards

1987-08-05

1989-03-14

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174 685, H01K 322

Patent

active

048114820

ABSTRACT:
A method for producing circuit boards having embedded three-dimensional wiring patterns and exposed mounting pads for receiving surface mounted components and terminals in which the exposed mounting pads are formed by forming junctions between the conductors and a substrate which is in turn used as at least a portion of mold for receiving hardenable material for encapsulating the conductors and forming the circuit board and in which the junctions become exposed to define mounting pads when the substrate is removed.

REFERENCES:
patent: 3077658 (1963-02-01), Wharton
patent: 3430338 (1969-03-01), Fhaherty
patent: 3889363 (1975-06-01), Davis
patent: 4710419 (1987-12-01), Gregory
IBM Tech. Discl. Bull., vol. 2, No. 1, Jun. 1959, p. 9, by Haddad et al.
IBM Tech. Discl. Bull., vol. 9, No. 11, p. 1520, Apr. 1967, by Kollmeier et al.

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