Method for producing microsystems

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S832000, C029S841000, C029S846000, C174S251000, C174S260000, C174S261000, C361S761000

Reexamination Certificate

active

08042267

ABSTRACT:
The invention relates to a method for producing microsystems comprising microelectronic components that are inserted into cavities created during the layered construction of a base body consisting of a photocurable material, said components being situated adjacent to and/or above one another on several planes and being interconnected either electrically or thermally. The invention is characterised in that once said microelectronic components have been inserted, the layered construction of the base body continues and that a structure is constructed consisting of an electrically or thermally conductive material that projects vertically above the contacts (pads) of the electronic component, said conductive material producing a direct connection to an additional electronic component above the first electronic component or to one or several additional electronic components that is or are located at a lateral distance from said first component by means of a conductor track that runs horizontally from the conductive material projecting vertically above the pad.

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patent: 3925455 (1991-02-01), None
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patent: 4420996 (1996-01-01), None
patent: 44 20 996 (1998-04-01), None
patent: 198 26 971 (2000-01-01), None
patent: 19826971 (2000-01-01), None
patent: 198 47 088 (2000-05-01), None
patent: 101 44 579 (2003-12-01), None
patent: WO 00 67538 (2000-11-01), None
Machine Translation of DE3925455.
Machine Translation of DE4420996.
Machine Translation of DE19826971.

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