Plastic and nonmetallic article shaping or treating: processes – Encapsulating normally liquid material – Liquid encapsulation utilizing an emulsion or dispersion to...
Patent
1992-12-28
1999-07-06
Lovering, Richard D.
Plastic and nonmetallic article shaping or treating: processes
Encapsulating normally liquid material
Liquid encapsulation utilizing an emulsion or dispersion to...
264 43, 264 47, 4284022, 42840221, B01J 1316, B01J 1302, B01J 1320
Patent
active
059194073
ABSTRACT:
A microencapsulated adhesive and a method for producing that microencapsulated adhesive are disclosed. The adhesive is produced from a solvent-based adhesive composition such as a styrene butadiene rubber composition or an acrylic. The solvent-based adhesive composition may be encapsulated by interfacial polymerization, gelatin/gum arabic coacervation or melamine/formaldehyde encapsulation. The solvent is removed from the microcapsules by heating or reduced pressure to form an adhesive that is non-tacky, but becomes tacky upon application of external forces, such as shearing. The microencapsulated adhesive composition may be used, among other applications, as an adhesive for stamps or envelopes.
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Lovering Richard D.
Moore Business Forms Inc.
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