Method for producing metal/ceramic bonding substrate

Details Method for producing metal/ceramic bonding substrate Method for producing metal/ceramic bonding substrate

2007-05-22

2007-05-22

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Process

Using dynamic frictional energy

C228S124500

Reexamination Certificate

active

10805768

ABSTRACT:
There is provided a method for producing a reliable metal/ceramic bonding substrate at low costs by forming a desired fillet on the peripheral portion of a metal circuit by a small number of steps. After an active metal containing brazing filler metal12is applied on a ceramic substrate10to bond a metal member14thereto, a resist16is applied on a predetermined portion of a surface of the metal member14to etch unnecessary portions, and then the resist is removed. Thereafter, unnecessary part of a metal layer12b, which is formed of a metal other than an active metal of the active metal containing brazing filler metal12, is etched with a chemical to be removed. Then, unnecessary part of an active metal layer12a, which is formed of the active metal and a compound thereof, is selectively etched with a chemical, which inhibits the metal member14and the metal layer12bfrom being etched and which selectively etch the active metal layer12b, to form a metal circuit on the ceramic substrate10. This metal circuit is chemically polished to form a fillet on the peripheral portion of the metal circuit.

REFERENCES:
patent: 6284985 (2001-09-01), Naba et al.
patent: 6399019 (2002-06-01), Sakuraba et al.
patent: 6613450 (2003-09-01), Tsukaguchi et al.
patent: 6858151 (2005-02-01), Tsukaguchi et al.
patent: 6918529 (2005-07-01), Tsukaguchi et al.
patent: 2594475 (1991-10-01), None

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