Method for producing metal/ceramic bonding substrate

Details Method for producing metal/ceramic bonding substrate Method for producing metal/ceramic bonding substrate

2011-04-19

2011-04-19

Ward, Jessica L (Department: 1735)

Metal founding

Process

Shaping liquid metal against a forming surface

C164S125000

Reexamination Certificate

active

07926543

ABSTRACT:
After a molten metal of aluminum or an aluminum alloy having a temperature, which is higher than the liquidus line temperature of aluminum or the aluminum alloy by 5 to 200° C., is injected into a mold, when the mold is cooled to solidify the molten metal, the molten metal injected into the mold is pressurized at a pressure of 1.0 to 100 kPa from a high-temperature side to a low-temperature side, and the mean cooling rate is set to be 5 to 100° C./minute while the mold is cooled from the liquidus line temperature to 450° C., the temperature gradient formed in the mold being set to be in the range of from 1° C./cm to 50° C./cm.

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