Method for producing masks for photolithography and the use...

Details Method for producing masks for photolithography and the use... Method for producing masks for photolithography and the use...

2005-02-22

2009-12-01

Huff, Mark F (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Radiation modifying product or process of making

Radiation mask

Reexamination Certificate

active

07625675

ABSTRACT:
A mask for photolithography methods comprises opaque and transparent areas as well as a surface structure. For the contact with a substrate (10) to be exposed at least a few opaque areas are incorporated and at least a few transparent areas are arranged in a spaced fashion and are deep-etched down to a structural depth. In a further embodiment at least one transparent area is designed as a positively resting area (12). The structural depth in the deep-etched areas is greater than the thickness of the surface structure, at least greater than or equal to 1 μm.

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patent: 2003/0205657 (2003-11-01), Voisin
patent: 006266091 (1994-09-01), None
patent: 98/40791 (1998-09-01), None

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