Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2008-07-22
2008-07-22
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C438S021000, C029S890100
Reexamination Certificate
active
07402256
ABSTRACT:
A method for producing a liquid-jet head comprises the steps of: forming a vibration plate and piezoelectric elements on one surface of a passage-forming substrate, and removing the vibration plate in a region to be a communicating portion, thereby forming an exposed portion; forming a wiring layer on the passage-forming substrate within the exposed portion, and forming lead electrodes; bonding a reservoir forming plate to the one surface of the passage-forming substrate; wet-etching the passage-forming substrate at the other surface thereof to form pressure generating chambers and the communicating portion; forming a liquid-resistant protective film on inner surfaces of the pressure generating chambers and the communicating portion; removing the protective film within the exposed portion; and performing wet etching on the communicating portion side to remove the wiring layer, thereby establishing communication between a reservoir portion and the communicating portion.
REFERENCES:
patent: 6758554 (2004-07-01), Kamei et al.
patent: 2004/0134881 (2004-07-01), Shimada et al.
patent: 2003-159801 (2003-06-01), None
Matsuzawa Akira
Ota Mutsuhiko
Culbert Roberts
Seiko Epson Corporation
Sughrue & Mion, PLLC
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