Method for producing lead frame material

Details Method for producing lead frame material Method for producing lead frame material

1991-04-05

1992-12-01

Valentine, Donald R.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly single metal or alloy substrate of...

205215, 205224, 205228, 205920, 20412935, 148518, 427328, 427360, 427370, C25D 700, C25D 534, C25D 550

Patent

active

051677946

ABSTRACT:
The present invention relates to a lead frame material for a semiconductor, which comprises a copper or copper alloy matrix having a layer obtained by applying an Ag-plating of a thickness of from 0.005 to 0.5 .mu.m on the surface of the matrix and diffusing Ag into the matrix by heat treatment.

REFERENCES:
patent: 3157539 (1964-11-01), Dreher
patent: 4270986 (1981-06-01), Smith
patent: 4521257 (1985-06-01), Gevatter et al.

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