Method for producing laminate board containing uniformly distrib

Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ

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29830, 29848, 156228, 156242, 1563069, 1563077, 264 461, 264 462, 264104, 264108, 264137, 264216, 264258, 264DIG6, B29C 4734

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046613013

ABSTRACT:
A process for continuously molding a plate for an electrical printed circuit board wherein a resin containing uniformly distributed hollow microspheres having a specific gravity different from that of the resin is extruded into a vertically disposed moving double belt press maintained at a temperature which allows the extruded plate to harden almost completely. The plate exists the vertically disposed press maintaining a flexibility sufficient to be passed around a roller into a horizonal position where subsequent processing steps may be applied, such as lamination of reinforcing fiber and coating with a conductive material.

REFERENCES:
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patent: 2993235 (1961-07-01), Brown et al.
patent: 3103406 (1963-09-01), Milewski et al.
patent: 3257484 (1966-06-01), Barnette
patent: 3434861 (1969-03-01), Luc
patent: 3586573 (1971-06-01), Vissers
patent: 3832426 (1974-08-01), Malthouse
patent: 4518737 (1985-05-01), Traut
IBM Tech. Disclosure Bull (USA) vol. 22, No. 5, 1799, Oct. 1979.

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