Method for producing image sensors with current flow into chip a

Details Method for producing image sensors with current flow into chip a Method for producing image sensors with current flow into chip a

1991-08-21

1992-08-11

Nelms, David C.

Radiant energy

Photocells; circuits and apparatus

Photocell controlled circuit

437 3, 437212, H01J 4014, H01L 3118

Patent

active

051381451

ABSTRACT:
Methods for the production of image sensors having simplified chip mounting are provided which comprise disposing a photo-setting type insulating resin on the upper side of a substrate, a portion of the substrate being transparent and having circuit conductor layers on its upper side; bringing an image sensor chip, the underside of which has electrodes, into contact with the upper side of the substrate so that the photo-setting type resin is wedged away and the electrodes come into contact with the corresponding circuit conductor layers; flowing current into the image sensor chip through the circuit conductor layers to determine that the image sensor chip operates in a normal manner; and irradiating the photo-setting type resin with light so that the resin is hardened.

REFERENCES:
patent: 4630355 (1986-12-01), Johnson
patent: 4786607 (1988-11-01), Yamazaki et al.
patent: 4806492 (1989-02-01), Suzuki et al.
patent: 5037780 (1991-08-01), Fujimoto et al.
patent: 5039620 (1991-08-01), Yamazaki et al.
patent: 5071787 (1991-12-01), Mori et al.
patent: 5079190 (1992-01-01), Mihara
Patent Abstracts of Japan, vol. 8, No. 66 (E-234), Mar. 28, 1984.

Affiliated with

Also associated with

Rating

Method for producing image sensors with current flow into chip a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing image sensors with current flow into chip a, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing image sensors with current flow into chip a will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-348223