Method for producing high temperature electrical connection

Details Method for producing high temperature electrical connection Method for producing high temperature electrical connection

1982-09-30

1983-12-27

Ozaki, G.

Metal working

Method of mechanical manufacture

Assembling or joining

29592R, 264 61, H01G 924

Patent

active

044222335

ABSTRACT:
Improved lead attachment method accommodates a situation wherein electrical signal leads must be connected to portions of a circuit operating at high temperatures such as 900.degree. F. or more and terminate in equipment operating at or near ambient temperatures. For example, in solid electrolyte oxygen sensors incorporating a tubular ceramic member, a connection wire which is sufficiently thick to resist wire breakage during normal handling has been found to be too thick to bond to a connection pad on the ceramic without having the bond crack during thermal cycling. With improved method, a thin wire is attached to a thicker one in a region where flexing cannot occur. At least the larger wire is shrunk-fit into a hole formed in the ceramic before firing, and then the thinner wire is bonded to the pad with a conductive paste which must also be fired.

REFERENCES:
patent: 4229275 (1980-10-01), Habdas et al.

Affiliated with

Also associated with

Rating

Method for producing high temperature electrical connection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing high temperature electrical connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing high temperature electrical connection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-941515