Method for producing heat sink and heat sink thus produced

Details Method for producing heat sink and heat sink thus produced Method for producing heat sink and heat sink thus produced

1986-09-18

1988-05-31

Lazarus, Ira S.

Heat exchange

Conduit within, or conforming to, panel or wall structure

165 804, 357 82, F28F 312

Patent

active

047474505

ABSTRACT:
In a heat sink for semiconductor elements and the like, a pipe made of a heat-conductive material such as copper, aluminum and the like is bent at a middle portion thereof and wound such that a forward flow passage and a return flow passage for a liquid coolant are both formed into a spiral shape with the bent portion held at the center of the spiral.

REFERENCES:
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patent: 1571929 (1926-02-01), Bronander
patent: 1847573 (1932-03-01), Rupp
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patent: 3213929 (1965-10-01), Marshall et al.
patent: 3711681 (1973-01-01), Leuschner et al.
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patent: 4010489 (1977-03-01), Bourbeau et al.
patent: 4287724 (1981-09-01), Clark
patent: 4602674 (1986-07-01), Eriksson
R. G. Christensen, IBM Technical Disclosure Bullentin, "Water-Cooled Heat Transfer Plate", vol. 23, No. 4, (09/80), p. 1445.

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