Method for producing flexible circuit boards

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156150, 156151, 427 96, 216 48, 216 52, H05K 302

Patent

active

056031580

ABSTRACT:
An adhesive is applied onto a flexible resistive film 1 and dried to form an adhesive layer 2. A metal foil 3 is contacted onto the layer 2, which is subjected to a heat and pressing treatment. The foil 3 is polished. An ultraviolet light curable ink is applied on the foil 3 and dried to form a first layer 4. A negative film is placed on or over the layer 4 and ultraviolet light is irradiated thereto through the film so that the layer 4 is cured. Uncured portions of the layer 4 is removed so that cured portions thereof remain and the foil 3 is exposed between the remaining cured portions. The metal foil 3 is subjected to an etching treatment to remove exposed portions of the foil 3 so that unexposed portions of the foil 3 remain and form conductors 3A. The cured portions of the layer 4 is removed from the conductors 3A. A metal plating film 5 is formed on each conductor 3A to form each electrical conductive circuit 9. An ultraviolet light curable ink is applied on the layer 2 and dried to form a second layer 7. Ultraviolet light is irradiated to the layer 7 through the film 1 so that the layer 7 is cured in gaps 6 between the circuits 9. Uncured portions of the layer 7 is removed so that the circuits 9 are exposed and cured portions of the layer 7 remain in the gaps 6. The cured portions of the layer 7 is subjected to a heat treatment. The resulting flexible circuit board comprises the film 1, the adhesive layer 2, the circuits 9 and cured films 8 filling the gaps 6.

REFERENCES:
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 4497975 (1985-02-01), Selsing
patent: 4584039 (1986-04-01), Shea
patent: 4608274 (1986-08-01), Wooten
patent: 4797508 (1989-01-01), Chant
patent: 4853277 (1989-08-01), Chant
patent: 5084124 (1992-01-01), Taniguchi
patent: 5331117 (1994-07-01), Bryant
patent: 5334421 (1994-08-01), McNutt
patent: 5369881 (1994-12-01), Inaba et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing flexible circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing flexible circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing flexible circuit boards will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1595141

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.