Method for producing encapsulated semiconductor from improved ep

Details Method for producing encapsulated semiconductor from improved ep Method for producing encapsulated semiconductor from improved ep

1988-12-08

1990-06-05

Draper, Garnette D.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

525507, 428413, 174137B, 174137R, 174137A, 528 87, C08G 800

Patent

active

049315153

ABSTRACT:
An epoxy resin composition comprising a novolak type epoxy resin which is produced from a substituted-phenol novolak and epihalohydrin, and is 0.15 or less in a maximum absorbance of a 3% (W/V) dichloromethane solution of the epoxy resin, the absorbance being measured at a wave number of between 3570 and 3600 cm.sup.-1 with an infrared spectrophotometer having a cell of 2 mm length, which is useful particularly in encapsulating and laminating applications in electronic fields.

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Patents Abstracts of Japan, vol. 6, No. 231 (C-135) [1109].
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