Method for producing electronic part sealed body

Details Method for producing electronic part sealed body Method for producing electronic part sealed body

1997-08-25

1999-03-23

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427214, 26427215, 26427217, B29C 7070, B29C 3502, B29C 4120

Patent

active

058855050

ABSTRACT:
A molding frame made by molding a thermoplastic norbornene resin which hardly deforms even after repeated use is used for production of electronic part sealed bodies by sealing the electronic devices of integrated circuits such as light emitting diodes, diodes, transistors, LSI devices, IC devices and CCD devices and capacitors, resistors, coils, microswitches and dipswitches with thermosetting resins such as epoxy resins as sealants.

REFERENCES:
patent: 4055613 (1977-10-01), Kapral
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patent: 4483811 (1984-11-01), Hirata
patent: 4635356 (1987-01-01), Ohuchi et al.
patent: 4843036 (1989-06-01), Schmidt et al.
patent: 4889677 (1989-12-01), Hashimoto et al.
patent: 4954308 (1990-09-01), Yabe et al.
patent: 5286439 (1994-02-01), Shinohara
patent: 5366812 (1994-11-01), Takahashi et al.
patent: 5409996 (1995-04-01), Shinohara et al.

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