Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-05-13
1995-06-06
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29843, 156256, 174 524, 22818021, 439 83, H05K 334
Patent
active
054210810
ABSTRACT:
A method for producing an electronic part mounting structure in which electronic parts such as IC packages are electrically connected to the surface of a printed circuit board utilizes a low-melting point metal. More particularly, the method provides an electronic part mounting structure capable of sufficiently and assuredly supplying solder to a portion between the terminal of a printed circuit board and the leads of an electric part while maintaining a predetermined thickness required to connect the printed circuit board and the electronic part to each other. By arranging the structure such that a gap, in which a solder layer having a predetermined thickness can be formed between the terminal of the printed circuit board and the lead of the electronic part to be connected to the terminal, is formed, the solder required to solder-connect the two elements can be sufficiently and assuredly supplied to the gap. Therefore, a reliable solder connection can be established.
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Ishida Toshiharu
Miyano Ichiro
Nakamura Hiroshi
Sakaguchi Suguru
Serizawa Kooji
Arbes Carl J.
Hitachi , Ltd.
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