Method for producing electronic componets

Details Method for producing electronic componets Method for producing electronic componets

2007-01-09

2007-01-09

Ahmed, Shamim (Department: 1765)

Etching a substrate: processes

Forming or treating optical article

C216S002000, C216S013000, C216S058000, C216S083000, C438S455000, C438S456000, C438S385000, C438S014000

Reexamination Certificate

active

10487604

ABSTRACT:
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or emitting device on at least a first side; producing at least one patterned support having at least one structure which is functional for the at least one sensor-technologically active and/or emitting device; joining the wafer with the at least one patterned support so that the first side faces the at least one patterned support; and separating the at least one die from the wafer.

REFERENCES:
patent: 5500540 (1996-03-01), Jewell et al.
patent: 5761350 (1998-06-01), Koh
patent: 5915168 (1999-06-01), Salatino et al.
patent: 6328482 (2001-12-01), Jian
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6967124 (2005-11-01), Huemoeller et al.
patent: 6974966 (2005-12-01), Jayaraman
patent: 101 41 571 (2003-03-01), None
patent: 102 22 959 (2003-12-01), None
patent: 102 22 960 (2003-12-01), None
patent: 550 973 (1993-07-01), None
patent: WO 99/18612 (1999-04-01), None
Article:Pfeiffer J et al: “Tunable Wavelength-Selective WDM Photodetector Based on MOEMS”; Annual Report Technical University Darmstadt, XX, XX, 1999, Seiten 94-98, XP002195782 das ganze Dokument.
Article: Jim K L et al. “Fabrication of Wafer Level Chip Scale Packaging for Optoelectronic Devices”; 1999 Proceedings 49thElectronic Components and Technology Conference (Cat. No. 99CH36299) 1999 Proceedings.49thElectronic Components and Technology Conference, San Diego, CA, USA Jun. 1-4, 1999, Seiten 1145-1147, XP002248941 1999, Piscataway, NJ, USA, IEEE, USA ISBN: 0-7803-5231-9 Abbildung 1.
Article: Leclercq J-L et al: “InP-based MOEMS and Related Topics”; Journal of Micromechanics and Microengineering, New York, NY, US, Bd. 10, Nr. 2, 27. Sep. 1999 (Sep. 27, 1999), Seiten 287-292, XP008002312 ISSN: 0960-1317 das ganze Dokument.

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