Method for producing electro-thermal separation type light...

Details Method for producing electro-thermal separation type light... Method for producing electro-thermal separation type light...

2010-08-27

2011-12-20

Arbes, Carl (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S827000, C029S832000, C029S840000, C257S099000, C257S100000, C257S675000, C257S676000

Reexamination Certificate

active

08079139

ABSTRACT:
A method for producing an electro-thermal separation type light emitting diode support structure is provided. One of the embodiments for the support structure has at least two heat dissipation bases and at least two conductive supports which are coupled by a heat dissipation plate and a support plate. Another embodiment for the support structure has at least two heat dissipation bases and at least two conductive supports which are formed by a thick-thin plate. The light emitting diode chips of different types can be configured on the heat dissipation bases of these designs, respectively. Therefore, the invention achieves the goal of using different types of light emitting diode chips at the same time.

REFERENCES:
patent: 6274924 (2001-08-01), Carey et al.
patent: 2004/0075100 (2004-04-01), Bogner et al.
patent: 2007/0001290 (2007-01-01), Wong et al.
patent: 2010/0148196 (2010-06-01), Kamada et al.

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