Method for producing displays and modular components

Details Method for producing displays and modular components Method for producing displays and modular components

1998-07-17

1999-12-14

Ramsey, Kenneth J.

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

29841, 29852, 438113, 438 28, 438 33, 445 24, H01L 2156, H05B 4300

Patent

active

RE0364460

ABSTRACT:
Processing techniques for various modular components provide various surface mount structures for single device components (10) and multiple device components (FIGS. 6 and 7) suitable as character displays. The technique beings with a slab of substrate material 12 patterned on both sides. Plated through holes (33, 43) connecting back side terminals (19, 20) to front side connective strips (22, 24) are formed. Devices (15, 16) are mounted to land areas (13, 34) and wire bonded to connecting pads (14). The front side is coated with epoxy to encapsulate the devices in a layer having an outer surface formed into optional lenses (262, 263). The slab is then separated to provide the modular components.

REFERENCES:
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patent: 4000437 (1976-12-01), Lederhandler et al.
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patent: 4445132 (1984-04-01), Ichikawa et al.
patent: 4508758 (1985-04-01), Wong
patent: 4525597 (1985-06-01), Abe
patent: 4603496 (1986-08-01), Latz et al.
patent: 4713579 (1987-12-01), Miura

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