Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2005-01-18
2008-07-29
Smith, Matthew S. (Department: 2823)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C359S891000, C359S892000, C353S084000, C348S743000, C356S418000, C352S241000
Reexamination Certificate
active
07405095
ABSTRACT:
A method for producing from a plate-shaped substrate circular sections for use for instance in a color wheel encompasses inter alia such steps as positioning predefined edge break lines in such fashion that the circular sections to be separated at a subsequent point are arranged in columns, with the circular sections within a column being so positioned relative to one another that in each case at least certain points of the inner annular edge are in contact with the outer annular edge of another circular section, thus forming part of a common predefined edge break line, while the orientation of the curvature of the circular sections of neighboring columns is reversed in alternating fashion. In a subsequent step the circular sections are separated along the predefined edge break lines.
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OC Oerlikon Balzers AG
Pearne & Gordon LLP
Singal Ankush k
Smith Matthew S.
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