Method for producing circuit substrate

Details Method for producing circuit substrate Method for producing circuit substrate

2007-07-17

2007-07-17

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S016000

Reexamination Certificate

active

10910271

ABSTRACT:
In order to provide a circuit substrate with a satisfactory step coverage by the protective layer and the anti-cavitation film in an edge portion of wirings and a liquid discharge head utilizing such circuit substrate, the invention provides a method for producing a circuit substrate provided, on an insulating surface of a substrate, with a plurality of elements each including a resistive layer and a pair of electrodes formed with a predetermined spacing on said resistive layer, including a step of forming an aluminum electrode wiring layer on the resistive layer, a step of isolating the electrode wiring layer by dry etching into each element, and a step of forming the electrode wiring into a tapered cross section with an etching solution containing phosphoric acid, nitric acid and a chelating agent capable of forming a complex with the wiring metal.

REFERENCES:
patent: 4455364 (1984-06-01), Sasa
patent: 5298112 (1994-03-01), Hayasaka et al.
patent: 5376231 (1994-12-01), Matsumoto et al.
patent: 2003/0076384 (2003-04-01), Tamura et al.
patent: 2004/0007767 (2004-01-01), Hayakawa et al.

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