Method for producing circuit boards with deposited metal pattern

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29846, 156150, 156630, 156634, 156650, 156656, 1566591, 156668, 156902, 427 96, 427 98, 428209, 428416, 428601, 428901, H05K 100, B32B 300, C23F 102, B29C 3700

Patent

active

047975083

ABSTRACT:
A process for producing circuit boards involves the coating of a resinous substrate with a fluid mixture of an epoxy polymer component and a rubber polymer which is interactive therewith at temperatures of at least 180.degree. F. Preferably the rubber is a low molecular weight polyfunctional reactive butadiene/acrylonitrile interpolymer which is terminated by vinyl or carboxyl functional groups. The rubber component comprises at least 70 percent by weight of the epoxy polymer component, and the coating has a thickness of 0.001-0.015 inch. The coating is partially cured to effect partial polymerization of the epoxy prepolymer, further polymerization of the rubber, if it is low molecular weight, and interaction of the rubber and epoxy polymer to form a matrix of the interacted rubber/epoxy. The exposed surface of this coating is then etched, and metal is deposited on the surface to form a conductive layer. A conductive pattern is formed therein, and heat and pressure are then applied to the conductive pattern and coating to fully cure the coating and bond the coating to the metal layer, and thus the conductive pattern to the resinous substrate. The metal layer may be deposited chemically or by vacuum metallizing and like techniques.

REFERENCES:
patent: 3226256 (1963-01-01), Schneble et al.
patent: 3312754 (1967-04-01), Marks et al.
patent: 3625758 (1971-12-01), Stahl et al.
patent: 3639500 (1972-02-01), Muny et al.
patent: 3737339 (1973-06-01), Alsberg et al.
patent: 3892819 (1975-07-01), Najvar
patent: 3910992 (1975-10-01), Skillicorn
patent: 3956041 (1976-05-01), Polichette et al.
patent: 4254186 (1981-03-01), Acitelli et al.
patent: 4374868 (1983-02-01), Stahl et al.
patent: 4389268 (1983-06-01), Oshima et al.
patent: 4402998 (1983-09-01), Kumagai et al.
patent: 4469777 (1984-09-01), O'Neil
patent: 4476285 (1984-10-01), Crabtree et al.
patent: 4511757 (1985-04-01), Ors et al.
patent: 4517050 (1985-05-01), Johnson et al.
patent: 4707394 (1987-11-01), Chant

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for producing circuit boards with deposited metal pattern does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing circuit boards with deposited metal pattern, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing circuit boards with deposited metal pattern will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2108632

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.