Method for producing circuit boards

Details Method for producing circuit boards Method for producing circuit boards

1983-12-07

1988-06-14

Beck, Shrive P.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 96, 427 97, B05D 512

Patent

active

047511052

ABSTRACT:
A method for producing circuit boards in which a plurality of planar circuit board bases having a circuit pattern thereon are interconnected at predetermined points. The method includes the steps of applying a mask over the circuit pattern on a base leaving, at the points to be interconnected, a window in the mask; applying an adhesive coating over the mask with the adhesive coating extending over the mask windows and onto the circuit pattern metal to form a second smaller window; treating and depositing metal on said adhesive coating to form a second circuit pattern on the plane of said adhesive and interconnecting the second circuit pattern with the first circuit pattern at said second windows; and, repeating said steps until a circuit board of the desired number of planar circuit patterns is produced.

REFERENCES:
patent: 3226256 (1965-12-01), Schneble, Jr. et al.
patent: 3350498 (1967-10-01), Leeds
patent: 3672986 (1972-06-01), Schneble, Jr. et al.
patent: 3697319 (1972-10-01), Feldstein
patent: 4005238 (1977-01-01), Gaehde
patent: 4152477 (1979-05-01), Haruta
Haining et al., "Multilayer Circuit", IBM TDB, vol. 11, No. 10, Mar., 1969, p. 1320.

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