Method for producing circuit board, for semiconductor package, h

Details Method for producing circuit board, for semiconductor package, h Method for producing circuit board, for semiconductor package, h

1997-12-16

1999-01-12

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

437121, H01L 2144

Patent

active

058588167

ABSTRACT:
In a method for producing a circuit board for a semiconductor package, portions of the resist film formed on the respective surface of the core substrate are removed during the exposure/development process, which portions correspond to the circuit pattern and to the cavity opening but having a diameter smaller than that of the cavity opening, whereby the photosensitive portion of the resist film is hardened while extending inward from the upper edge of the cavity opening to a predetermined distance. The resist film operates as a resist for the conductor layer to be formed on the inner wall of the cavity opening and connected to the circuit pattern on one surface of the core substrate. Thereby, since the finally formed conductor layer does not reach the upper edge of the cavity opening at a predetermined vacant space therefrom, short-circuiting of the signal line is prevented from occurring even if the bonding wire is brought into contact with the upper edge of the cavity opening. Thus, it is possible to improve the yield in the production of plastic packages as well as the quality of the resultant packages.

REFERENCES:
patent: 4965227 (1990-10-01), Chang et al.
patent: 5205036 (1993-04-01), Yamazaki
patent: 5441918 (1995-08-01), Morisaki et al.
patent: 5474957 (1995-12-01), Urushima
patent: 5556807 (1996-09-01), Bhattacharyya et al.
patent: 5557502 (1996-09-01), Banerjee et al.
patent: 5599747 (1997-02-01), Bhatt et al.
patent: 5607883 (1997-03-01), Bhattacharyya et al.
patent: 5643818 (1997-07-01), Sachdev et al.

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