Method for producing chip- and fiber-board webs of uniform thick

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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100 93RP, 100 47, 100170, 156 64, 156358, 1565835, 425367, 425373, 264109, 264 405, B27N 326

Patent

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050571672

ABSTRACT:
A method of continuously manufacturing chip and fiberboard webs having uniform thickness across their width in a press comprising a centrally disposed press cylinder journalled to rotate in bearings in uprights and at least one pressure roller, and preferably three pressure rollers, disposed adjacent the periphery of the press cylinder. An endless steel band carrying the material for forming the web is subjected to tensile stress and is guided around the press cylinder and through the nip defined between the press cylinder and the pressure roller. The material is pressed between the endless steel band and the surface of the press cylinder. The pressure roller is journalled for rotation in bearings at each of its ends. When the press is in its loaded state, the bearing body at one end of the pressure roller is displaced by the application of a preselected pressure towards the axis of rotation of the press cylinder. The spacing between the external surface of the press cylinder and that of the pressure roller is measured at such end and the same spacing is then set at the other end of the pressure roller by adjusting the bearing body at that end. By means of a microprocessor, it is possible to preselect specific gap sizes at all of the pressure rollers so as to produce a specific thickness of board, with the pressure rollers being held exactly parallel.

REFERENCES:
patent: 3006225 (1961-10-01), Mamas
patent: 3445070 (1969-05-01), Verdier
patent: 3874962 (1975-04-01), Gersbeck et al.

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