Method for producing ceramic substrate and electronic...

Plastic and nonmetallic article shaping or treating: processes – Outside of mold sintering or vitrifying of shaped inorganic... – Of electrical article or electrical component

Reexamination Certificate

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Details

C264S614000, C264S672000, C156S089120

Reexamination Certificate

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07378049

ABSTRACT:
A method for producing a ceramic substrate of the present invention includes a first process of providing holes in a shrinkage suppressing layer, a second process of filling the holes with a thick film material, a third process of laminating the shrinkage suppressing layer filled with the thick film material on an outermost layer of a ceramic substrate sintered in a preparatory process, followed by pressing, thereby obtaining a laminate, a fourth process of sintering the laminate, and a fifth process of removing the shrinkage suppressing layer. Thus, the kind of convex portions formed on the outermost layer of the ceramic substrate can be increased.

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patent: 5843798 (1998-12-01), Matsuda
patent: 6132543 (2000-10-01), Mohri et al.
patent: 7105070 (2006-09-01), Tosa et al.
patent: 2003/0100146 (2003-05-01), Nakano et al.
patent: 6-53655 (1994-02-01), None
patent: 7-142630 (1995-06-01), None
patent: 7-202422 (1995-08-01), None
patent: 2000-323806 (2000-11-01), None

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