Method for producing ceramic-based electronic components

Plastic and nonmetallic article shaping or treating: processes – Pore forming in situ – By mechanically introducing gas into material

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264 58, 432258, 432259, C04B 3546

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active

053364538

ABSTRACT:
A method of heat treating ceramic-based electronic components by providing a furnace fixture adapted to support the ceramic-based electronic components which is made from a substrate selected from the group consisting of silicon carbide (SiC), cordierite (2MgO.2Al2O.sub.3.5SiO.sub.2), mullite (3Al.sub.2 O.sub.3.2SiO.sub.2), stabilized zirconia, and alumina (Al.sub.2 O.sub.3) containing a glassy bond phase. A cladding layer of zirconia is then deposited on the furnace fixture substrate by plasma deposition. The ceramic-based electronic component to be fired is placed on the zirconia-coated substrate; and heated to a desired temperature to heat treat the component.

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