Method for producing an optical or electronic module...

Details Method for producing an optical or electronic module... Method for producing an optical or electronic module...

2005-07-27

2008-10-28

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

C438S014000, C438S018000, C257SE21522

Reexamination Certificate

active

07442559

ABSTRACT:
A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.

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http://en.wikipedia.org/wiki/Coordinate—system; Accessed May 9, 2008.

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