Method for producing an optical device

Details Method for producing an optical device Method for producing an optical device

1986-09-09

1988-03-01

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

350 9620, 350 9621, 437188, H05K 334

Patent

active

047276495

ABSTRACT:
In the package for optical device according to the present invention, since electroconductive paste printed on a sapphire substrate cut lower in the central portion beforehand is prevented from rising higher at ends than in other portion after burning, irregularity on the surface of a die bonding pad is eliminated. In the optical device according to the present invention, since an electrode and a solder layer having each a light introducing hole are sequentially mounted in layers on the die-bonded side of an optical device chip which is die-bonded to the die bonding pad by said solder layer, the optical device chip is die-bonded in a stable state.

REFERENCES:
patent: 4268113 (1981-05-01), Noel, Jr.
patent: 4326771 (1982-04-01), Henry et al.

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