Method for producing an electronic component using direct bondin

Details Method for producing an electronic component using direct bondin Method for producing an electronic component using direct bondin

1995-05-04

1998-06-30

Hall, Carl E.

Metal working

Piezoelectric device making

310344, 310348, H01L 4122

Patent

active

057715556

ABSTRACT:
An electronic component includes a first substrate and a second substrate. A first conductive layer constituting a terminal electrode is formed on a first surface of the first substrate. A first insulating layer is formed on the first conductive layer. The first insulating layer and the second substrate are directly bonded to each other by at least one bond selected from the group consisting of a hydrogen bond and a covalent bond.

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