Method for producing an electronic component, especially a...

Details Method for producing an electronic component, especially a... Method for producing an electronic component, especially a...

2002-05-13

2008-03-04

Graybill, David E (Department: 2822)

Semiconductor device manufacturing: process

Making device array and selectively interconnecting

Using structure alterable to nonconductive state

C438S467000, C438S601000, C438S662000, C438S940000, C257SE21596, C257SE21592, C257SE23150

Reexamination Certificate

active

07338843

ABSTRACT:
A method for producing an electronic component, especially a memory chip, using a laser-induced correction to equalize an integrated circuit by means of at least one laser via in a layer at least partially covering the circuit. The component comprises a rewiring of the contact pads. The inventive method comprises the following steps: each laser via is closed by means of a separate covering layer which is to be applied locally; a rewiring extending between the local covering layers is created; the local covering layers are removed; and the laser-induced correction is carried out by means of the open laser vias.

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KIPO Office Action, Nov. 15, 2005 in Korean Application Ser. No. 9-5-2005-057770030.

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