Method for producing an electrical conductor element

Details Method for producing an electrical conductor element Method for producing an electrical conductor element

2007-06-26

2007-06-26

Ngô, Ngân V. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000

Reexamination Certificate

active

10922360

ABSTRACT:
The present invention relates to a method for producing an electrical conductor element with a housing and a conductor element, whereby the housing is made by a molding process and the conductor is embedded in the housing, whereby the conductor is produced by an electroforming process on a metallic layer. The conductor and the metallic layer are covered with the housing by a molding process, and the metallic layer is removed from the conductor and the molding housing. This method advantageously combines the well known molding process and the well known electroforming process for providing a reliable process for producing an electrical conductor element.

REFERENCES:
patent: 4147740 (1979-04-01), Swiger et al.
patent: 6218203 (2001-04-01), Khoury et al.
patent: 2002/0031905 (2002-03-01), Beroz
patent: 2006/0060981 (2006-03-01), Paulus
patent: 1246308 (2002-10-01), None
patent: 1246308 (2003-08-01), None

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