Method for producing an electrical component

Details Method for producing an electrical component Method for producing an electrical component

2008-03-04

2008-03-04

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S455000, C438S462000, C257SE21499

Reexamination Certificate

active

10521322

ABSTRACT:
To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.

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English Translation of International Preliminary Examination Report for application PCT/EP2003/005859.

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