Method for producing an electrical circuit

Details Method for producing an electrical circuit Method for producing an electrical circuit

2005-05-31

2005-05-31

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S723000, C257S738000, C257S737000, C257S782000, C257S783000

Reexamination Certificate

active

06900536

ABSTRACT:
An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to the conductive layers, and affixing the substrates together with the conductive layers between the substrates. These are either separate substrates or a unitary substrate. The IC is mounted either to a substrate, a conductive layer, or a dielectric layer. The IC is coupled to the conductive layers either directly or through openings formed in the dielectric layer. An interior conductive layer may be used to couple the IC to the conductive layers.

REFERENCES:
patent: 6300679 (2001-10-01), Mukerji et al.
patent: 6486544 (2002-11-01), Hashimoto

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