Method for producing alloy of low thermal expansion

Metal treatment – Compositions – Heat treating

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148 12A, 148336, C21D 800

Patent

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049369253

ABSTRACT:
In production of alloy for lead frames used in semiconductor integration circuits, a Fe-base alloy of a specified composition is annealed at a temperature above its recrystallization point and, thereafter, worked at 13 to 40% degree of working in order to subject the resultant elongation by thermal expansion close to those of Si, SiC and Si.sub.3 N.sub.4 over wide range of temperature.

REFERENCES:
patent: 2470653 (1949-05-01), Schulman et al.

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