Method for producing alloy films using cold sputter deposition p

Details Method for producing alloy films using cold sputter deposition p Method for producing alloy films using cold sputter deposition p

1995-07-10

1997-01-28

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419212, 20419215, 20419217, 437198, C23C 1434

Patent

active

055974589

ABSTRACT:
A method for forming an alloy film by cooling a substrate during a sputter deposition process. In one embodiment, aluminum-copper (Al-Cu) alloy film is deposited on a substrate while the substrate is maintained at a temperature lower than 100.degree. C. during a sputter deposition process, thereby reducing the precipitation of CuAl.sub.2. The substrate is cooled by pumping a coolant gas through a cooled platen and against the substrate during processing. Subsequent film formation prior to etching is also performed below 100.degree. C. to prevent precipitation of CuAl.sub.2 until the Al-Cu alloy film is etched. Large crystal grains are formed by annealing the substrate after etching.

REFERENCES:
D. R. Denison et al, J. Vac. Sci. Technol., vol. 17, No. 6, Nov./Dec. 1980, pp. 1326-1330.
"Grain Growth in Al-2% Cu Thin Films", J. E. Sanchez, Jr., et al., (1992), Materials Science Forum, vol. 94-96, pp. (1992) pp. 563-570.
"The Evolution of Microstructure in Al-2 Pct Cu Thin Films: Precipitation, Dissolution, and Reprecipitation", D. R. Frear et al., (Sep. 1990), Metallurgical Transactions, vol. 21A, pp. 2449-2458.

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