Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-05-02
2006-05-02
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S593000, C029S829000, C029S832000, C029S840000, C029S841000, C029S844000, C029S847000, C029S850000, C257S668000, C257S690000, C324S1540PB, C324S754090, C324S755090, C324S761010, C324S765010, C361S777000, C439S067000
Reexamination Certificate
active
07036218
ABSTRACT:
A method for producing a wafer interposer (210) for use in a wafer interposer assembly is disclosed. The wafer interposer (210) is produced by attaching solder bumps (140) to a lower surface of a support (120). First electrical terminals (130) are attached to an upper surface of the support (120) and substantially correspond to the solder bumps (140). First electrical pathways are provided that passes through the support (120) and connect the solder bumps (140) to the first electrical terminals (130). Second electrical terminals (310) are attached to the upper surface of the support (120). Second electrical pathways (320) connect the first electrical terminals (130) to the second electrical terminals (310).
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Denamraj & Youst, P.C.
Eaglestone Partners I, LLC
Phan Tim
Tugbang A. Dexter
Youst Lawrence R.
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