Method for producing a thin film semiconductor device

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427108, 427109, 4271262, B32B 1700

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060133104

ABSTRACT:
A thin film semiconductor device including an insulating substrate; and a structure provided on the insulating substrate and including a silicon layer containing hydrogen diffused therein and a silicon nitride layer. The insulating substrate is formed of an insulating material having a thermal expansion coefficient of 2.6.times.10.sup.-6 deg.sup.-1 or more or having a distortion point of 850.degree. C. or lower.

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