Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-09-10
1995-02-07
Jones, W. Gary
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 731, 156 732, 1562722, 156282, 156268, 156498, 156499, 156514, 156517, 83 56, 83 23, 83 25, 83440, 834401, 83875, B32B 3100
Patent
active
053873050
ABSTRACT:
The process for the production of a thermoelectrically weldable zone in thermoplastic materials is significantly improved by the true-to-size, air-free embedding of the heating conductor at a clearly defined depth below the joining surface. For this purpose in a first process step a sublevel wire bed bottom is cut in the material, in which is cut a substantially inverted T-shaped incision, running in two planes and at the desired depth, measured from the material surface and, following the surface profile, the cut is passed along the heating conductor insertion line. Using the same tool the cover strips formed are raised and stretched along the path of cut, so that an open channel is formed with the sublevel wire bed bottom. Preferably in the same operation the wire bed is also cut true-to-size with a cutting tool and corresponding to the heating conductor. In a later process step the heating conductor is placed through the still open channel, the cover strips are pressed and then melted. What is left behind is a groove-free, smooth joint surface, over which extends a fine, non-raised melt scar.
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De Simone Mark
Farley Walter C.
Jones W. Gary
Streng Plastic AG
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