Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-09-16
2000-03-14
Lorin, Francis J.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156245, 156292, B32B 3100
Patent
active
060368012
ABSTRACT:
A thermally insulated double-walled synthetic resin container having a thermal insulator layer filled with a low thermal conductivity gas, wherein the inner container and the outer container are formed from a chemical resistant resin, a hole portion is provided at the enter of the bottom wall of the outer container, this hole portion is sealed by a sealing panel formed from chemical resistant resin; a protrusion portion is formed on the thermal insulator layer side of the bottom central portion of the outer container and a depression portion aligned with the center of the protrusion portion is formed on the reverse side of this protrusion portion; or a metallic thin film layer is formed on the surfaces facing the thermal insulator layer aside from the area around the mouth; as a result of which the thermally insulated double-walled synthetic resin container is provided with exceptional thermal insulation capabilities and strength.
REFERENCES:
patent: 4258695 (1981-03-01), McCarton et al.
Patent Abstracts of Japan, vol. 95, No. 007, Aug. 31, 1995 and JP 07 101475 A (Nippon Sanso KK), Apr. 18, 1995 (Abstract).
Fujii Takafumi
Furuyama Kensuke
Kamachi Hidefumi
Kato Rikiya
Komiya Yasuhiko
Lorin Francis J.
Nippon Sanso Corporation
LandOfFree
Method for producing a thermally insulated double-walled synthet does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for producing a thermally insulated double-walled synthet, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a thermally insulated double-walled synthet will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-165269