Method for producing a tablet for resin-molding semiconductor de

Details Method for producing a tablet for resin-molding semiconductor de Method for producing a tablet for resin-molding semiconductor de

1988-11-16

1990-10-16

Thurlow, Jeffery

Plastic and nonmetallic article shaping or treating: processes

Vacuum treatment of work

To degas or prevent gas entrapment

264120, 26427217, 264294, 264320, 264325, B29C 4356

Patent

active

049633074

ABSTRACT:
A resin-molding tablet for use in resin-molding semiconductor devices has a tablet body formed of powdered or particulate resin. The particles of the resin are compacted such as to form voids between adjacent particles. At least the outer peripheral region of the tablet is fused such that the resin particles are welded together to form a continuous layer of fine and impervious structure substantially free of open pores. The internal air trapped in the voids of the tablet is drawn and removed before the tablet is fused so that the tablet is substantially free of air. The tablet is produced by placing a particulate or powdered resin material in a vacuum vessel so as to allow the internal air in the resin material to be drawn outside, and then applying pressure and heat to the resin material so that at least the peripheral region of the mass of the particulate resin is fused to weld together. The tablet thus formed is melted and forcibly fed into a vacuum die cavity in which a semiconductor device to be molded is accommodated, thereby to hermetically seal the semiconductor device. Thus, a semiconductor package having substantially no voids is produced.

REFERENCES:
patent: 3071814 (1963-01-01), Buggenheim
patent: 3608023 (1971-09-01), Scarborough
patent: 4045867 (1977-09-01), Strom
patent: 4511317 (1985-04-01), Bandoh
patent: 4569814 (1986-02-01), Chong et al.
patent: 4741787 (1988-05-01), Shimizu et al.

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