Method for producing a surface stabilizing protective layer in s

Adhesive bonding and miscellaneous chemical manufacture – Methods

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Details

156 17, 156247, 156297, H01L 750, B32B 3100

Patent

active

039473031

ABSTRACT:
An improved method for producing a layer of a protective lacquer, which ioves the blocking properties and stabilizes the surface of a semiconductor device, on the edge surface of a semiconductor body in the region where the pn-junction or junctions of the device formed in the body exit to the surface, wherein the semiconductor wafers are applied, at mutual spacings appropriate for their further processing, to a plastic support layer which is heated until it softens, after cooling of the support a protective lacquer is introduced in the spaces between the semiconductor wafers to enclose the pn-junction(s) coming to the surface, and after hardening of the protective lacquer the lacquer foil formed thereby together with the semiconductor wafers embedded therein is removed from the support. According to the invention, the plastic layer is initially placed onto the surface of a metallic base plate which is provided with planar raised portions; the semiconductor wafers have surfaces conforming to the surface of these raised portions and are placed thereon; the plastic support produces an adhesive connection between the semiconductor wafers and the base plate but does not enter a firm bond with the protective lacquer; and the protective lacquer foil is removed from the support after the support layer has been heated to a temperature which causes same to soften.

REFERENCES:
patent: 3690984 (1972-09-01), Wanesky
patent: 3706409 (1972-12-01), Lederer
patent: 3739463 (1973-06-01), Aird et al.
patent: 3766638 (1973-10-01), Moore
patent: 3888053 (1975-06-01), White et al.

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