Method for producing a surface-mountable semiconductor...

Details Method for producing a surface-mountable semiconductor... Method for producing a surface-mountable semiconductor...

2007-04-02

2009-02-10

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S125000, C438S126000, C438S127000, C257SE21502, C257SE21504

Reexamination Certificate

active

07488622

ABSTRACT:
Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical connections, which are electrically conductively connected to at least two electrical contacts of the semiconductor chip, and an encapsulation material.

REFERENCES:
patent: 4843280 (1989-06-01), Lumbard
patent: 5162896 (1992-11-01), Takubo et al.
patent: 5371404 (1994-12-01), Juskey et al.
patent: 5814837 (1998-09-01), Okazaki
patent: 5859475 (1999-01-01), Freyman et al.
patent: 5994773 (1999-11-01), Hirakawa
patent: 6174175 (2001-01-01), Behfar et al.
patent: 6365979 (2002-04-01), Miyajima
patent: 7015593 (2006-03-01), Kazama
patent: 2001/0013647 (2001-08-01), Hsu
patent: 2002/0195935 (2002-12-01), Jager et al.
patent: 2004/0047151 (2004-03-01), Bogner et al.
patent: 199 63 806 (2001-07-01), None
patent: 100 08 203 (2001-08-01), None
patent: 100 41 328 (2002-03-01), None
patent: 1 056 126 (2000-11-01), None
patent: 2000-049382 (2000-02-01), None
patent: 2002-1274463 (2001-10-01), None
patent: 2002-064164 (2002-02-01), None
patent: 2002-110858 (2002-04-01), None
patent: WO 97/50132 (1997-12-01), None
patent: WO 99/18609 (1999-04-01), None
“Surface Mount LED Lamp, Super Bright 0402”, p. 1-6, Fairchild Semiconductor Corp., Aug. 3, 2001.
Search Report dated Nov. 27, 2003 issued for the underlying International Application No. PCT/DE2003/02259.

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