Method for producing a stamped substrate

Details Method for producing a stamped substrate Method for producing a stamped substrate

1988-11-23

1990-02-06

Eley, Timothy V.

Ordnance

Firing devices

Safety

29844, 29509, H01R 914

Patent

active

048979198

ABSTRACT:
A method and apparatus is provided for forming a power distribution system during a punching operation. A planar member of conductive material is located proximate to the substrate upon which the power distribution system is to be formed. A punch used to form the conductors from the planar member and deposit the conductors on the substrate. The action of the punch causes mechanical interference between the conductor and the substrate thereby securing the conductor to the substrate.

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