Method for producing a semiconductor modular structure

Details Method for producing a semiconductor modular structure Method for producing a semiconductor modular structure

1993-11-24

1995-01-10

Heinrich, Smauel M.

Metal fusion bonding

Process

Using a compliant cushioning medium

228 55, 228212, 437212, B23K 2000, B23K 2016

Patent

active

053799429

ABSTRACT:
A method for producing a semiconductor modular structure includes placing semiconductor bodies, a ceramic substrate with metallizing, and a metal base plate, in an elastomer compression mold. A heatable pressure ram with a surface being concave relative to the base plate is placed on the base plate. At least the base plate and the ceramic substrate are convexely deformed and joined with pressure exerted by the pressure ram, at a temperature above room temperature.

REFERENCES:
patent: 4903885 (1990-02-01), Schwarzbauer
patent: 5058796 (1991-10-01), Schwarzbauer
patent: 5158226 (1992-10-01), Schwarzbauer
patent: 5300458 (1994-04-01), Kuhnert et al.

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