Method for producing a semiconductor integrated circuit device i

Details Method for producing a semiconductor integrated circuit device i Method for producing a semiconductor integrated circuit device i

1993-04-12

1994-01-18

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437195, 437922, H01L 2170, H01L 2700

Patent

active

052799840

ABSTRACT:
A semiconductor integrated circuit device in which circuit functions can be remedied or changed by severing at least a portion of a circuit pattern and a method for producing such semiconductor integrated circuit device. The circuit pattern is formed on the semiconductor substrate. A field shield plate is formed on the major surface of the semiconductor substrate for electrically separating respective elements constituting the circuit. The circuit pattern includes a fuse element. The fuse element is provided on the field shield plate. The portion of the field shield plate lying directly below the fuse element is isolated from other portions of the field shield plate. In such semiconductor integrated circuit device, the portion of the field shield plate lying directly below the fuse element is separated from other portions of the field shield plate, so that short-circuiting between the semiconductor substrate and the field shield plate cannot occur even when the laser beam is irradiated with a laser beam deviation at the time of severing of the fuse element.

REFERENCES:
patent: 3959047 (1976-05-01), Alberts et al.
patent: 4219827 (1980-08-01), Kaisa
patent: 4437107 (1984-03-01), Jonsson et al.
patent: 4455567 (1984-06-01), Lee et al.
patent: 4570331 (1986-02-01), Eaton, Jr. et al.
patent: 4581628 (1986-04-01), Miyauchi et al.
patent: 4598462 (1986-07-01), Chandrasekhar
patent: 4641286 (1987-02-01), Shimotori et al.
patent: 4682204 (1987-07-01), Shiozaki et al.
patent: 4748491 (1988-05-01), Takagi
patent: 4757359 (1988-07-01), Chiao et al.
patent: 4795720 (1989-01-01), Kawanabe et al.
patent: 4814853 (1989-03-01), Uchida
patent: 4853758 (1989-08-01), Fischer
patent: 4864379 (1989-09-01), Schade, Jr.
patent: 4881106 (1989-11-01), Barron
patent: 4893167 (1990-01-01), Boudou et al.
patent: 4984054 (1991-01-01), Yamada et al.
patent: 5025300 (1991-06-01), Billig et al.
patent: 5067000 (1991-11-01), Eimori et al.
Semiconductor World (Jun. 1983), pp. 82-85.
Scribner, "Noise Isolation by Field Shield Segmentation", IBM TDB, vol. 18, No. 11 (Apr. 1976), p. 3589.
Blose et al, "Unique Field Plate for an IC Transistor", IBM TDC, vol. 22, No. 9 (Feb. 1980), pp. 4030-4031.
Wu, "Personlizable Semiconductor Device with Diffusion for Preventing Short Circuit From Laser Weld", IBM, vol. 23, No. 6 (Nov. 1980), p. 2336.

Affiliated with

Also associated with

Rating

Method for producing a semiconductor integrated circuit device i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for producing a semiconductor integrated circuit device i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for producing a semiconductor integrated circuit device i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1136087